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features ? high brightness ? small size ? industrial standard footprint ? diffused optics ? top emitting or right angle emitting ? compatible with ir soldering ? compatible for use with light piping ? available in 8 mm tape on 7" diameter reel ? reel sealed in zip locked moisture barrier bags applications ? lcd backlighting ? push button backlighting ? front panel indicator ? symbol indicator ? microdisplays ? small message panel signage description these small chip-type leds utilize high efficient and high brightness ingan material to deliver competitively priced high performance blue and green. these 520 nm green and 470 nm blue are unique hues which provide color differentiation to a product. these chipleds come in either top emitting packages (hsmx-c130, c150, c170, c177, c190, c191, c197), in side emitting packages (hsmx-c110, c120) or in a reverse mount package (c265). the side emitting package is especially suitable for lcd backlighting application. the top emitting packages, with their wide viewing angle, are suitable for direct backlighting application or being used with light pipes. in order to facilitate pick and place operation, these chipleds are shipped in tape and reel with 4000 units per reel for hsmx-c120, c130, c170, c177, c190, c191 and c197 packages, and 3000 units per reel for hsmx-c110, c150 and c265 packages. all packages are compatible with ir soldering and binned by both color and intensity. agilent hsmx-c1xx high performance chip led data sheet hsmq-c110/120/150/170/177/190/191/197/265, hsmr-c110/120/130/150/170/177/190/191/197/265 caution: hsmq-c1xx and hsmr-c1xx are class 1 esd sensitive per mil-std-1686. please observe appropriate precautions during handling and processing. refer to agilent technologies application note an-1142 for additional details.
2 package dimensions notes: 1. all dimensions in millimeters (inches). 2. tolerance is ?0.1 mm (?0.004 in.) unless otherwise specified. 2.0 (0.079? 0.3 (0.012) 0.4 ?0.15 (0.016 ?0.006) 0.3 (0.012) polarity cathode mark 0.8 (0.031) 0.4 ?0.15 (0.016 ?0.006) 1.4 (0.055) 0.62 (0.024) led die diffused epoxy pc board soldering terminal 1.25 (0.049) hsmx-c170 cathode line hsmx-c190 1.6 (0.063? 0.3 (0.012) 0.3 ?0.15 (0.012 ?0.006) 0.3 (0.012) polarity cathode mark 0.8 (0.031) 0.3 ?0.15 (0.012 ?0.006) 1.0 (0.039) 0.4 (0.016) led die diffused epoxy pc board soldering terminal 0.8 (0.031) 0.7 (0.028) min. cathode line hsmx-c191 1.6 (0.063? 0.3 (0.012) 0.3 ?0.15 (0.012 ?0.006) 0.3 (0.012) polarity cathode mark 0.6 (0.023) 0.3 ?0.15 (0.012 ?0.006) 1.0 (0.039) 0.4 (0.016) led die diffused epoxy pc board soldering terminal 0.8 (0.031) cathode line 0.7 (0.028) min. 3.2 (0.126 ) 0.5 (0.020) 0.8 (0.031) polarity cathode line 1.5 (0.059) led die clear epoxy pc board soldering terminal 1.0 (0.039) 1.0 (0.039) 2.6 (0.102 ) 1.6 (0.063 ) cathode line 3.2 (0.126 ) hsmx-c110
3 package dimensions, continued notes: 1. all dimensions in millimeters (inches). 2. tolerance is ?0.1 mm (?0.004 in.) unless otherwise specified. hsmx-c150 3.2 (0.126? 0.5 (0.020) 0.50 ?0.20 (0.020 ?0.008) 0.6 (0.024) polarity cathode mark 1.1 (0.043) 0.50 ?0.20 (0.020 ?0.008) 2.0 (0.079) 0.8 (0.031) led die diffused epoxy pc board soldering terminal 1.6 (0.063) cathode line cathode mark led die 1.25 (0.049) 0.62 (0.025) 2.00 (0.079) diffused epoxy pc board 0.40 (0.016) 0.16 (0.006) polarity 0.40 ?0.15 (0.016 ?0.006) soldering terminal 1.10 (0.043) min. 0.40 ?0.15 (0.016 ?0.006) cathode line hsmx-c177 0.80 (0.031) 1.60 (0.063) polarity 0.70 (0.028) min. cathode line 0.30 ?0.15 (0.012 ?0.006) diffused epoxy pc board 0.40 (0.016) 0.16 (0.006) soldering terminal 0.40 (0.016) cathode mark led die hsmx-c197 1.6 (0.063) 0.5 (0.020) polarity cathode mark 1.0 (0.039) 3 ?0.3 (0.012) 1.2 (0.047) 0.3 (0.012) led die clear epoxy pc board soldering terminal 0.6 (0.024) cathode line hsmx-c120
4 absolute maximum ratings at t a = 25?c hsmq-cxxx parameter hsmr-cxxx units dc forward current [1] 20 ma power dissipation 78 mw reverse voltage (i r = 100 m a) 5 v led junction temperature 95 ?c operating temperature range C30 to +85 ?c storage temperature range C40 to +85 ?c soldering temperature see reflow soldering profile (figures 11 & 12) device selection guide package dimension (mm) [1], [2] ingan green ingan blue package description 3.2(l) x 1.0(w) x 1.5(h) hsmq-c110 hsmr-c110 untinted, non-diffused 1.6(l) x 0.6(w) x 1.0(h) hsmq-c120 hsmr-c120 untinted, non-diffused 1.6(l) x 0.8(w) x 0.35(h) C hsmr-c130 untinted, diffused 3.2(l) x 1.6(w) x 1.1(h) hsmq-c150 hsmr-c150 untinted, diffused 2.0(l) x 1.25(w) x 0.8(h) hsmq-c170 hsmr-c170 untinted, diffused 2.0(l) x 1.25(w) x 0.4(h) hsmq-c177 hsmr-c177 untinted, diffused 1.6(l) x 0.8(w) x 0.8(h) hsmq-c190 hsmr-c190 untinted, diffused 1.6(l) x 0.8(w) x 0.6(h) hsmq-c191 hsmr-c191 untinted, diffused 1.6(l) x 0.8(w) x 0.4(h) hsmq-c197 hsmr-c197 untinted, diffused 3.4(l) x 1.25(w) x 1.1(h) HSMQ-C265 hsmr-c265 untinted, non-diffused notes: 1. dimensions in mm. 2. tolerance 0.1 mm unless otherwise noted. note: 1. derate linearly as shown in figure 4. notes: 1. all dimensions in millimeters (inches). 2. tolerance is ?0.1 mm (?0.004 in.) unless otherwise specified. package dimensions, continued 1.6 (0.063) 0.12 (0.005) 0.3 ?0.15 (0.012 ?0.006) 0.23 (0.009) cathode mark 0.35 (0.014) 0.3 ?0.15 (0.012 ?0.006) 1.15 (0.045) led die diffused epoxy pcb board 0.8 (0.031) cathode line 0.7 (0.028) min. polarity (0.625) soldering terminal hsmx-c130 3.4 (0.134) 0.3 (0.012) 0.50 ?0.15 (0.020 ?0.006) 1.1 (0.043) polarity cathode mark (etched) 1.1 (0.043) 0.50 ?0.15 (0.020 ?0.006) 1.2 (0.047) 1.25 (0.049) led die undiffused epoxy pc board soldering terminal green solder mask cathode line hsmx-c265
5 optical characteristics at t a = 25?c luminous color, viewing luminous intensity peak dominant angle efficacy i v (mcd) wavelength wavelength 2 q 1/2 h v @ 20 ma [1] l peak (nm) l d [2] (nm) degrees [3] (lm/w) part number color min. typ. typ. typ. typ. typ. hsmq-c110 green 45 150 520 527 130 500 hsmq-c120 green 45 145 520 527 155 500 hsmq-c150/170/190/191 green 45 145 520 527 140 500 hsmq-c177/197 green 45 145 520 527 130 500 HSMQ-C265 green 45 140 520 527 150 500 hsmr-c110 blue 18 60 469 473 130 88 hsmr-c120 blue 18 55 469 473 155 88 hsmr-c130 blue 18 55 469 473 145 88 hsmr-c150/170/190/191 blue 18 55 469 473 140 88 hsmr-c177/197 blue 18 55 469 473 130 88 hsmr-c265 blue 18 45 469 473 150 88 notes: 1. the luminous intensity, i v , is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp package. 2. the dominant wavelength, l d , is derived from the cie chromaticity diagram and represents the perceived color of the device. 3. q 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. electrical characteristics at t a = 25?c forward voltage reverse breakdown capacitance c thermal v f (volts) v r (volts) (pf), v f = 0, resistance @ i f = 20 ma @ i r = 100 m a f = 1 mhz r q jCpin (?c/w) part number typ. max. min. typ. typ. hsmq-c110/c150 3.4 3.9 5 140 450 hsmr-c110/c150 3.4 3.9 5 140 450 hsmq-c120 3.4 3.9 5 100 450 hsmr-c120/c130 3.4 3.9 5 100 450 hsmq-c170/c190/c191 3.4 3.9 5 110 300 hsmr-c170/c190/c191 3.4 3.9 5 110 300 hsmq-c177/c197 3.4 3.9 5 110 350 hsmr-c177/c197 3.4 3.9 5 110 350 HSMQ-C265 3.4 3.9 5 65 300 hsmr-c265 3.4 3.9 5 65 300 v f tolerance: 0.1 v blue color bins [1] dom. wavelength (nm) bin id min. max. a 460.0 465.0 b 465.0 470.0 c 470.0 475.0 d 475.0 480.0 note: 1. bin categories are established for classification of products. products may not be available in all categories. please contact your agilent representative for information on currently available bins. color bin limits [1] ingan green color bins [1] dom. wavelength (nm) bin id min. max. a 515.0 520.0 b 520.0 525.0 c 525.0 530.0 d 530.0 535.0 tolerance: 1 nm tolerance: 1 nm
6 figure 1. relative intensity vs. wavelength. light intensity (iv) bin limits [1] intensity (mcd) intensity (mcd) bin id min. max. bin id min. max. a 0.11 0.18 n 28.50 45.00 b 0.18 0.29 p 45.00 71.50 c 0.29 0.45 q 71.50 112.50 d 0.45 0.72 r 112.50 180.00 e 0.72 1.10 s 180.00 285.00 f 1.10 1.80 t 285.00 450.00 g 1.80 2.80 u 450.00 715.00 h 2.80 4.50 v 715.00 1125.00 j 4.50 7.20 w 1125.00 1800.00 k 7.20 11.20 x 1800.00 2850.00 l 11.20 18.00 y 2850.00 4500.00 m 18.00 28.50 tolerance: 15% note: 1. bin categories are established for classification of products. products may not be available in all categories. please contact your agilent representative for information on currently available bins. figure 2. forward current vs. forward voltage. figure 3. luminous intensity vs. forward current. figure 4. maximum forward current vs. ambient temperature. 100 10 1 0.1 2.0 2.5 3.0 3.5 4.0 v f ?forward voltage ?v i f ?forward current ?ma green blue 05 15 i f ?forward current ?ma 0 0.4 1.0 luminous intensity (normalized at 20 ma) 20 0.6 0.2 0.8 10 25 1.2 green blue wavelength ?nm relative intensity ?% 100 50 0 600 700 blue green 500 400 90 80 70 60 40 30 20 10 0 0 20 60 80 90 5 i f max ?maximum forward current ?ma t a ?ambient temperature ?? 40 15 10 20 r q j-a = 600?/w r q j-a = 500?/w 25 10 30 50 70
7 figure 5. relative intensity vs. angle for hsmx-c110. figure 6. relative intensity vs. angle for hsmx-c120. relative intensity ?% 100 0 angle 80 60 20 40 -70 -50 -30 30 50 70 90 -90 -10 10 relative intensity ?% 100 0 angle 80 60 20 40 -70 -50 -30 30 50 70 90 -90 -10 10 100 90 80 70 60 50 40 30 20 10 0 relative intensity -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 angle 100 90 80 70 60 50 40 30 20 10 0 relative intensity -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 angle
8 figure 9. relative intensity vs. angle for hsmx-c170, c190, c191, and c150. figure 7. relative intensity vs. angle for hsmx-c177 and c197. figure 8. relative intensity vs. angle for hsmx-c130. figure 10. relative intensity vs. angle for hsmx-c265. relative intensity ?% 100 0 angle 80 60 50 70 20 10 30 40 90 -70 -50 -30 0 2030507090 -90 -20 -80 -60 -40 -10 10 40 60 80 relative intensity ?% 100 0 angle 80 60 50 70 20 10 30 40 90 -70 -50 -30 0 2030507090 -90 -20 -80 -60 -40 -10 10 40 60 80 relative intensity ?% 100 0 angle 80 60 50 70 20 10 30 40 90 -70 -50 -30 0 2030507090 -90 -20 -80 -60 -40 -10 10 40 60 80 relative intensity ?% 100 0 angle 80 60 50 70 20 10 30 40 90 -70 -50 -30 0 2030507090 -90 -20 -80 -60 -40 -10 10 40 60 80
9 figure 12. recommended pb-free reflow soldering profile. figure 13. recommended soldering pattern for hsmx-c110. figure 14. recommended soldering pattern for hsmx-c170/177. 5.0 (0.200) 1.0 (0.039) 1.5 (0.059) 1.5 (0.059) 2.0 (0.079) 0.9 (0.035) 0.2 (0.008) 0.9 (0.035) centering board note: 1. all dimensions in millimeters (inches). 1.2 (0.047) 1.2 (0.047) 0.9 (0.035) 1.2 (0.047) figure 16. recommended soldering pattern for hsmx-c150. 1.5 (0.059) 1.5 (0.059) 1.5 (0.059) 2.0 (0.079) figure 15. recommended soldering pattern for hsmx-c130/190/191/197. 0.8 (0.031) 0.8 (0.031) 0.7 (0.028) 0.8 (0.031) figure 17. recommended soldering pattern for hsmx-c120. figure 18. recommended soldering pattern for hsmx-c265. 0.7 (0.028) 0.8 (0.031) 0.8 (0.031) 1.2 (0.047) 0.4 (0.016) 0.15 (0.006) 0.4 (0.016) centering board 1.25 (0.049) 1.4 (0.055) 2.3 (0.091) 1.4 (0.055) 2.2 (0.087) dia. pcb hole 217 ? max. 120 sec. 6 ?/sec. max. 3 ?/sec. max. 100 - 150 ? 255 ? (+5/-0) 60 to 150 sec. 10 to 20 sec. time temperature * the time from 25 ? to peak temperature = 6 minutes max. figure 11. recommended reflow soldering profile. 230? max. 10 sec. max. 4?/sec. max. over 2 min. time temperature 4?/sec. max. 140-160? 3?/sec. max.
10 figure 19. reeling orientation. figure 20. reel dimensions. cathode side user feed direction printed label note: 1. all dimensions in millimeters (inches). 10.50 ?1.0 (0.413 ?0.039) 59.60 ?1.00 (2.346 ?0.039) 20.20 min. ( 0.795 min.) 6 ps 178.40 ?1.00 (7.024 ?0.039) 3.0 ?0.5 (0.118 ?0.020) 4.0 ?0.5 (0.157 ?0.020) 5.0 ?0.5 (0.197 ?0.020) 13.1 ?0.5 ( 0.516 ?0.020) 8.0 ?1.0 (0.315 ?0.039)
11 figure 21. tape dimensions. note: 1. all dimensions in millimeters (inches). 8.00 ?0.30 (0.315 ?0.012) user feed direction dim. a (see table 1) 3.50 ?0.05 (0.138 ?0.002) 1.75 (0.069) dim. c (see table 1) 0.20 ?0.05 (0.008 ?0.002) carrier tape cover tape dim. b (see table 1) 4.00 (0.157) 2.00 ?0.05 (0.079 ?0.002) 4.00 (0.157) 1.50 (0.059) table 1 dimensions in millimeters (inches) cathode dim. a ?0.10 (0.004) dim. b ?0.10 (0.004) part number dim. c ?0.10 (0.004) hsmx-c110/120 position in carrier tape dim. b (see table 1) dim. a (see table 1) r 1.0 ?0.05 (0.039 ?0.002) for hsmx-c110 1.20 (0.047) 0.80 (0.031) 1.27 (0.050) 0.95 (0.037) 0.70 (0.028) 0.87 (0.034) 0.85 (0.033) 0.60 (0.024) 0.23 ?0.05 (0.009 ?0.002) for hsmr-c130 r 0.5 ?0.05 (0.020 ?0.002) for hsmx-c120 hsmx-c110 series hsmx-c120 series hsmx-c150 series hsmx-c170 series hsmx-c177 series hsmx-c190 series hsmx-c191 series hsmx-c197 series 3.40 (0.134) 1.90 (0.075) 3.50 (0.138) 2.30 (0.091) 2.25 (0.089) 1.80 (0.071) 1.85 (0.073) 1.75 (0.069) 1.70 (0.067) 1.15 (0.045) 1.88 (0.074) 1.45 (0.057) 1.32 (0.052) 0.95 (0.037) 0.88 (0.035) 0.95 (0.037) 8.00 ?0.30 (0.315 ?0.012) user feed direction dim. a (see table 1) 3.50 ?0.05 (0.138 ?0.002) 1.75 (0.069) dim. c (see table 1) 0.20 ?0.05 (0.008 ?0.002) carrier tape cover tape dim. b (see table 1) 4.00 (0.157) 2.00 ?0.05 (0.079 ?0.002) 4.00 (0.157) 1.50 (0.059) hsmx-c265 series 3.70 (0.146) 1.45 (0.057) 1.30 (0.051) table 1 dimensions in millimeters (inches) cathode dim. a ?0.10 (0.004) dim. b ?0.10 (0.004) part number dim. c ?0.10 (0.004)
figure 22. tape leader and trailer dimensions. convective ir reflow soldering for more information on ir reflow soldering, refer to application note 1060, surface mounting smt led indicator components . notes: 1. all dimensions in millimeters (inches). 2. tolerance is ?0.1 mm (?0.004 in.) unless otherwise specified. storage condition: 5 to 30 c @ 60% rh max. baking is required under the condition: a) the blue silica gel indicator becoming white/transparent color b) the pack has been open for more than 1 week baking recommended condition: 60 5 c for 20 hours. end start there shall be a minimum of 160 mm (6.3 inch) of empty component pockets sealed with cover tape. mounted with components there shall be a minimum of 160 mm (6.3 inch) of empty component pockets sealed with cover tape. minimum of 230 mm (9.05 inch) may consist of carrier and/or cover tape. www.agilent.com/semiconductors for product information and a complete list of distributors, please go to our web site. for technical assistance call: americas/canada: +1 (800) 235-0312 or (916) 788-6763 europe: +49 (0) 6441 92460 china: 10800 650 0017 hong kong: (+65) 6756 2394 india, australia, new zealand: (+65) 6755 1939 japan: (+81 3) 3335-8152 (domestic/interna- tional), or 0120-61-1280 (domestic only) korea: (+65) 6755 1989 singapore, malaysia, vietnam, thailand, philippines, indonesia: (+65) 6755 2044 taiwan: (+65) 6755 1843 data subject to change. copyright ? 2004 agilent technologies, inc. obsoletes 5988-4832en april 22, 2004 5989-0493en

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